This installation documentation is for the Bachmann Consolidation 2-8-0. This particular model features a new style of tender unlike previous runs of the Consolidation. This installation uses the WSK-BAC-2 WOWkit which includes the B-MB2, UNIV-SH2-C speaker kit, and WOW121-Steam decoder. Also used in this installation is the 6-Pin Mini Connector. This installation was performed by TCS.
Please do not use any flux either liquid or paste on the mother board. Over time, the acidic properties of liquid or paste flux will begin eating away at the fiberglass PCB and will damage it. Use only Rosin-core solder or no-clean flux approved for electronics use.
TCS recommends the use of Kester "44" Sn63 Pb37, .015" diameter Rosin-core solder. Kester part number 24-6337-0007.
You can order this solder from the following retailers:
Digikey - PN:KE1110-ND
Techni-Tool - PN:488SO6775
When stripping wire, only strip a tiny little bit of the insulation. Strip no more than a 1/32 of an inch. When the wire gets tinned with solder, the insulation will shrink back more. Try to not expose any more wire than half the length of the solder pad at most. In no case should solder or exposed wire wire ever be outside the boundary of the the solder pad you are attaching a wire to.
Click here for important information on properly Stripping and Tinning wire